MoSys Participates at TSMC Open Innovation Platform

SANTA CLARA, Calif. — (BUSINESS WIRE) — October 18, 2011MoSys (NASDAQ: MOSY):



MoSys (NASDAQ: MOSY), a leading provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs, is exhibiting at TSMC Open Innovation Platform®.



TSMC Open Innovation Platform is a two-day conference for TSMC customers and partners. The first day of the event is TSMC OIP Partner Workshop. Partners will receive technical information on 28nm process and design technologies, plus an early look at 20nm design enablement programs in a seminar format. The TSMC OIP Ecosystem Forum will take place on the second day of the event. It is open to TSMC customers and will offer a direct OIP marketing venue to reach these customers.


TSMC Open Innovation Platform takes place October 17-18, 2011.


San Jose McEnery Convention Center
150 San Carlos Street
San Jose, CA 95113

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