Tech Soft 3D Announces Third Annual Customer Meeting at COFES 2012

BERKELEY, CA -- (MARKET WIRE) -- Feb 23, 2012 -- Tech Soft 3D, leading provider of component technology to the engineering software industry, today announced its third annual Customer Meeting will again be held at COFES, The Congress on the Future of Engineering Software, on Thursday, April 12, in Scottsdale, Arizona. The Customer Meeting will feature roadmaps, highlights and demonstrations of the HOOPS Product Suite, as well as a discussion of the industry variables that guide these time-tested and innovative components.

"We aggregate the needs of hundreds of application developers, so our strategic planning is a good bellwether of where things may be headed in the industry at large," said Tech Soft 3D CEO, Ron Fritz. "We look forward to again welcoming customers, partners, press and potential customers to what has become a fun and informative annual event."

Those interested in attending the invitation-only COFES can contact Ron Fritz at Email Contact to arrange an invitation. The event is slotted from 1-3 p.m. on Thursday, April 12 at the Scottsdale Plaza Resort, Las Palmas Room "A." For more itinerary details, visit the Annual Tech Soft 3D Customer Meeting webpage.

About COFES

COFES is a unique event that focuses on intense sessions of discussion, argument and debate on issues that will affect businesses that invest in and depend upon engineering technologies. The 13th annual COFES runs Thursday, April 12 through Sunday, April 15. See the COFES website for additional information on the agenda, keynote speakers and registration.

About Tech Soft 3D

Tech Soft 3D is the leading global provider of premier component technologies and related services that enable software developers to rapidly create world-class technical software. The company develops the HOOPS Product Suite, consisting of HOOPS Visualize, HOOPS Exchange and HOOPS Publish, SDKs for visualization, CAD data import/export and 3D PDF publishing. It also resells premium components such as Autodesk's RealDWG® Toolkit and AutoCAD® OEM platform and the Parasolid® Modeling Kernel from Siemens PLM Software. Tech Soft 3D software is used in nearly 450 applications worldwide. The company maintains corporate headquarters in Berkeley, California and can be reached through http://www.techsoft3d.com

 

 

 







Review Article Be the first to review this article
Featured Video
Editorial
Latest Blog Posts
Jobs
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Upcoming Events
Canadian Manufacturing Technology Show 2021 at The International Centre (Hall 2) 6900 Airport Road Mississauga, Ontario L4V 1E8 Canada - Oct 4 - 7, 2021
Houstex 2021 at George R. Brown Convention Center Houston TX - Oct 5 - 7, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
HxGN Live Design & Engineering 2021 - Virtual at United Kingdom - Oct 12 - 14, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise