Former Apple and Broadcom Executive, Dr. Edward H. Frank, Joins eASIC Board of Directors

Santa Clara, CA – November 25, 2013 – eASIC® Corporation, a leading provider of Single Mask Adaptable ASIC™ devices today announced the appointment of Dr. Edward H. Frank to the company’s Board of Directors. Dr. Frank was recently Vice President of Macintosh Hardware Systems Engineering at Apple, Inc. and currently serves on the board of directors for  Fusion-io, Inc.

“Ed’s strong and proven history of developing and bringing revolutionary solutions to market makes him an excellent addition to our board of directors”, said Ronnie Vasishta, president and CEO of eASIC. “His expertise in delivering innovative silicon and systems, at companies both large and small, will be invaluable as we continue to provide unique silicon customizations solution to our system customers.”

“Custom silicon is critical for developing innovative solutions”, said Dr. Frank. “But cost, engineering effort, and development time are major issues. eASIC’s proven Single Mask Adaptable ASIC dramatically reduces those impediments, creating unique and significant opportunities for eASIC customers. I am excited to be working with the eASIC team and leveraging my experience and expertise to further accelerate the company’s growth.”

Previously, Dr. Frank was the vice president of research and development at  Broadcom, following its acquisition of Epigram, Inc., a company he co-founded. Dr. Frank also co-founded  NetPower Inc. and held senior technology leadership positions at  Sun Microsystems Inc. He is a named inventor on over 50 patents and is a  Life Trustee of Carnegie Mellon University. Dr. Frank holds BSEE and MSEE degrees from  Stanford University and a Ph.D. in  Computer Science from Carnegie Mellon University.

About eASIC

eASIC is a fabless semiconductor company offering breakthrough Single Mask Adaptable ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer a new generation of ASICs with significantly lower up-front costs than traditional ASICs.



Contact: 

Niall Battson
eASIC Corporation
(408) 855 9200
Email Contact 




Review Article Be the first to review this article

Featured Video
Editorial
Latest Blog Posts
Sanjay GangalMCADCafe Lens
by Sanjay Gangal
NVIDIA GTC October 2020 Keynote
Jobs
Service Software Expert-CATIA & CAA for Dassault Systemes at Shanghai, China
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Senior Software Developer (Revit API) for Microdesk at Boston, Massachusetts
Project Architect for Handel Architects LLP at San Francisco, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
PLM Road Map & PDT Spring 2021 at 3909 Research Park Drive Ann Arbor MI - May 19 - 20, 2021
TCT ASIA 2021 at National Exhibition and Convention Centre(NECC) Shanghai China - May 26 - 28, 2021
RAPID + TCT at McCormick Place Chicago IL - Sep 13 - 15, 2021
WESTEC Online at Online CA - Sep 21 - 23, 2021
Kenesto: 30 day trial
MasterCAM



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise