New DEVISE Solution From ISE Powered By Spatial's 3D ACIS Modeler

WESTMINSTER, Colo. & ZURICH, Switzerland—(BUSINESS WIRE)—July 13, 2004— Spatial Corp., a Dassault Systemes (Nasdaq: DASTY) (Euronext Paris: #13065, DSY.PA) company and market-leading provider of 3D subsystems, and Integrated Systems Engineering (ISE) today announced that ISE's new DEVISE(TM) solution is powered by Spatial's 3D ACIS(R) Modeler.

"ISE used Spatial's 3D ACIS Modeler to build DEVISE, a very versatile and easy-to-use 2D and 3D structure editor and process emulator for semiconductor devices," said Dr. Eugeny Lyumkis, vice president of development for ISE. "The tool can emulate semiconductor manufacturing processes and serves as a GUI for ISE's grid generators MESH(TM) and NOFFSET3D(TM). DEVISE is ideal for conceptualizing new devices or quickly analyzing parametric data for semiconductors, with all the advantages of 3D."

By utilizing Spatial's 3D ACIS Modeler, DEVISE can generate 2D and 3D structures using CAD operations or process emulation commands such as etch and deposit. DEVISE also provides state-of-the-art visualization and an interactive graphical user interface and is fully scriptable.

"ISE, like many of our partners, has found our ACIS Modeler to provide a solid platform for an application that extends past the boundaries of traditional solid modeling," said Keith Mountain, president and chief operating officer, Spatial. "ISE's success with ACIS is a concrete example of how Spatial has developed over the past 15 years as a company that provides solutions not just for CAD/CAM but also for numerous other industries."

About Spatial

Spatial Corp., a Dassault Systemes S.A. (Nasdaq: DASTY) (Euronext Paris # 13065, DSY.PA) company, is a market-leading provider of world-class 3D software subsystem technologies. Spatial develops, markets, and supports best-of-breed 3D subsystem technologies and services, to address the requirements of 3D in Business-to-Business (B2B) applications. Spatial's subsystem products for 3D modeling, visualization, and interoperability have been adopted by some of the world's most recognized software developers, manufacturers, research institutes, and universities. In addition, by working as the premier marketing and sales organization for the Component Application Architecture (CAA) V5, Spatial now provides companies with the opportunity to develop advanced solutions complementary to the Product Lifecycle Management (PLM) solutions offered by Dassault Systemes. Headquartered in Westminster, Colorado, Spatial has offices in the USA, Germany, France, Japan, and the United Kingdom. For more information, please visit Spatial's Web site at www.spatial.com, or contact Spatial by email at info@spatial.com or by phone at 303-544-2900.

About ISE

Integrated Systems Engineering (ISE) is a world-leading provider of Technology CAD (TCAD) software that covers the entire range from process simulation to device and circuit simulation. Today, 18 of the 20 top semiconductor manufacturers use ISE TCAD(TM) for the design and optimization of their processes. Since its establishment in 1993, ISE has focused exclusively on TCAD and offers software solutions and consulting services to some of the world's largest semiconductor fabrication facilities. For more information, visit ISE at www.ise.com.

About Dassault Systemes

As world leader in 3D PLM (three-dimensional Product Lifecycle Management) solutions, the Dassault Systemes group brings value to more than 70,000 customers in 80 countries. A pioneer in the 3D software market since 1981, Dassault Systemes develops and markets 3D PLM application software and services that support industrial processes and provide a 3D vision of the entire life cycle of products from conception to maintenance. Its offering includes 3D PLM integrated solutions for product development (CATIA(R), ENOVIA(R), DELMIA(R), SMARTEAM(R)), mainstream 3D solutions (SolidWorks), and 3D components (ACIS(R)) from Spatial Corp. Dassault Systemes is listed on the Nasdaq (DASTY) and Euronext Paris (#13065, DSY.PA) stock exchanges. For more information, visit http://www.3ds.com.

ACIS and SAT are registered trademarks of Spatial Corp. All other trademarks belong to their respective owners.



Contact:
Spatial Corp. 
Chad Sanderson, 303-544-2932

Email Contact



Review Article Be the first to review this article
Featured Video
Editorial
Latest Blog Posts
Joseph LopezPROSTEP INC Blog
by Joseph Lopez
OpenPDM MIGRATE supports Windchill Bulk Migrator
Roberto FrazzoliMCADCafe Editorial
by Roberto Frazzoli
A closer look at CCE’s EnSuite – Cloud ReVue LiveLink
Jobs
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
BIM/VDC Coordinator for MBH Architects at Alameda, California
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
WESTEC Online at Online CA - Sep 21 - 23, 2021
Canadian Manufacturing Technology Show 2021 at The International Centre (Hall 2) 6900 Airport Road Mississauga, Ontario L4V 1E8 Canada - Oct 4 - 7, 2021
Houstex 2021 at George R. Brown Convention Center Houston TX - Oct 5 - 7, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise