Cadence Announces the HiFi Integrator Studio


SAN JOSE, Calif., Feb. 22, 2016 — (PRNewswire) —  Cadence Design Systems, Inc. (NASDAQ: CDNS), today announced the Cadence® HiFi Integrator Studio, an audio software framework that provides OEMs and application developers faster time to market when integrating Tensilica® HiFi DSP-based systems on chip (SoCs) into their products. This announcement also includes the first hardware integration into the Android Studio development platform. Cadence is scheduled to demonstrate the "OK Google" voice trigger and audio playback integration with Android Studio and the Realtek ALC5677 at the Mobile World Congress in Barcelona, February 22 to 25, at Fira Gran Via, Hall 6, Stand 6L36.

Cadence Logo. (PRNewsFoto/Cadence Design Systems, Inc.) (PRNewsFoto/CADENCE DESIGN SYSTEMS_ INC_)

The HiFi Integrator Studio provides a standard operating-system (OS)-agnostic software framework to interface audio, voice and sensor functions running on the HiFi DSP to higher level applications such as media players or recorders. It enables high-level application programmers using Java/C++ to leverage the power-savings and acceleration benefits of the HiFi DSP without having to understand the low-level programming details of a real-time DSP.

The HiFi Integrator Studio currently supports two main use cases, with additional ones in development. The first use case is targeted at SoCs where the HiFi DSP is the main processor, such as in a Bluetooth headset. The second use case is targeted at systems where a host application processor (AP) offloads audio and/or voice tasks to the HiFi DSP processor. Examples include using the HiFi DSP as part of the AP SoC and/or in codec chips for ultra-low-power, glitch-free audio playback, and noise suppression and echo cancellation for superior voice experience.

The Android OS version demonstrates a complete end-to-end application from Java applications at the top, to Android Marshmallow-based middleware, to offloaded code running on the HiFi DSP—all in the Android Studio development environment. The integration with Android leverages the previously announced Cadence Tensilica HiFi Audio Tunneling for Android, which can reduce audio processing power by up to 14X and double smartphone playback time. By integrating the HiFi DSP in hardware together with Google's Android Studio emulator running on a PC, system developers can separate audio integration from Android bring-up, allowing earlier development of audio system software and enabling the developers to take advantage of the rich debugging environments available on PCs. Releases for Linux and other popular OSs will follow.

The Tensilica HiFi DSP is production proven for ultra-low power audio and voice functions in mobile devices. It has a well-supported ecosystem with over 175 proven audio/voice software packages and over 80 partners. All of the existing 175+ available applications utilize the common HiFi applications programming interface (API) and are fully plug-and-play ready for integration using HiFi Integrator Studio. For more information on the Tensilica HiFi DSP family, visit

"We created the HiFi Integrator Studio to provide an environment for designers to easily integrate HiFi DSP-based SoCs into the most widely used OSs," said Larry Przywara, group director of audio/voice DSP marketing at Cadence. "This framework speeds first-time integration of the HiFi-based SoCs and provides a clean separation of host OS and application software. In addition, the audio framework has been architected to support easy and fast maintenance and upgrades of HiFi-based platforms with the latest host AP OS releases."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at

This press release contains certain forward-looking statements that are based on our current expectations and involve numerous risks and uncertainties that may cause these forward-looking statements to be inaccurate. Risks that may cause these forward-looking statements to be inaccurate include, among others: our product development plans may change, and the other risks detailed from time-to-time in our U.S. Securities and Exchange Commission filings and reports, including, but not limited to, our most recent quarterly report on Form 10-Q and our annual report on Form 10-K. We do not intend to update the information contained in this press release.

© 2016 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and Tensilica are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. Android is a trademark of Google Inc. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Design Systems, Inc.
Email Contact


To view the original version on PR Newswire, visit:

SOURCE Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

Review Article Be the first to review this article
Featured Video
Latest Blog Posts
Industry ExpertsMCADCafe Editorial
by Industry Experts
MCADCafe Industry Predictions for 2022 – Xometry
Engineering / Software Sales Representative for Azore CFD Software at Livonia, Michigan
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
GIS Data Analyst for Texas Department of Transportation at Austin, Texas
GIS Analyst for New Mexico Gas Company, Inc. at Albuquerque -New Mexico, Wyoming
Fluid Dynamic Engineer / CFD Developer for Azore CFD Software at Livonia, Michigan
Upcoming Events
Simulation World 2022 at United States - May 18, 2022
3DEXPERIENCE FORUM 2022 at Diplomat Beach Resort Hollywood FL - Jun 6 - 8, 2022
Smart Manufacturing Experience at Pittsburgh PA - Jun 7 - 9, 2022

© 2022 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise