Leti Extends CMOS Platforms’ Lifespan and Explores New Computing Paradigms

Research Results, Presented at 2016 VLSI Symposia, Suggest that FDSOI Technology Can Be Harnessed for Several More Generations of Digital Devices

GRENOBLE, France – June 17, 2016 – Leti, an institute of CEA Tech, said today its teams have demonstrated how Fully Depleted Silicon on Insulator (FDSOI) technology can be scaled downwards and how the experience in thin-film engineering built on FDSOI development can be harnessed for innovative architectures and computing paradigms.

At the recent 2016 Symposia on VLSI Technology and Circuits, Leti reported how performance boosters can be successfully implemented on a short time scale to increase performance of next-generation FDSOI devices using material engineering and design/technology co-optimization. With its current performance and flexibility, the FDSOI platform can be extended to the 10nm node. Looking further ahead, thin-film management expertise will be leveraged to design high-performance stacked nanowires.

Based on its expertise in CMOS technologies and thin-film integration, Leti also shared its latest results on CoolCubeTM high-density 3D integration. For the first time, 3D-via density above 10 million/mm² has been demonstrated and high CMOS FDSOI performance has been achieved within a low-temperature integration. CoolCubeTM, which powerfully leverages the benefits of the third dimension, provides designers with a wide range of design opportunities.

Through extreme device scaling, Leti and Inac, a fundamental research division of CEA, are exploring the emerging quantum computing era with an extended use of FDSOI technology for chip design and fabrication.

“These results, which highlight the technology depth of the Grenoble ecosystem, stem from more than a decade of research on ways to use FDSOI-nanowire silicon technologies to design devices with an accurate control of single charge,” said Maud Vinet, Leti’s advanced CMOS manager. “We are currently leveraging this R&D activity, which relies primarily on extensive research in low-temperature physics of ultra-scaled MOS FET properties developed by Leti and Inac, to investigate the potential that silicon FDSOI technology has for quantum computing.”

Leti and its long-time research partner Inac have been investigating a silicon-on-insulator technology for quantum computing applications that could rely on the scalability originally developed for CMOS VLSI circuits. Applying Inac’s expertise in cryogenic electrical measurements and Leti’s SOI nanowire FET technology, the teams also demonstrated the co-integration of quantum devices with conventional CMOS control electronics (ring oscillators) on 300 mm SOI substrates.

About Leti (France)

As one of three advanced-research institutes within the CEA Technological Research Division, Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 59 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,900, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on www.leti.fr and @CEA_Leti.

About INAC (France)

A joint CEA-Univ. Grenoble Alpes research Institute, Inac is a (rating by French evaluation agency) “a world class institute producing fundamental and multidisciplinary research, relevant partnerships with industry/technology developers”. Inac research activities range from nanoscale physics to chemistry and technology at the frontier of biology, encompassing photonics, spintronics, several technologies for energy and health, and cryogenic engineering. Over the last five years, Inac research led to approx. 1500 papers, 100 patents, and to the creation of 5 start-ups. Follow us on inac.cea.fr.

Press contacts


+33 6 74 93 23 47                              

Email Contact



Read the complete story ...

Review Article Be the first to review this article
Featured Video
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Senior Highway Engineer for RS&H at Jacksonville, Florida
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Upcoming Events
Canadian Manufacturing Technology Show 2021 at The International Centre (Hall 2) 6900 Airport Road Mississauga, Ontario L4V 1E8 Canada - Oct 4 - 7, 2021
Houstex 2021 at George R. Brown Convention Center Houston TX - Oct 5 - 7, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
HxGN Live Design & Engineering 2021 - Virtual at United Kingdom - Oct 12 - 14, 2021

© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise