Connect more with TI's portfolio of wireless connectivity modules for Industry 4.0 and IoT designs

TI expands its module portfolio with new Bluetooth® low energy certified module with integrated antenna

DALLAS, Oct. 24, 2016 — (PRNewswire) —  Wireless connectivity modules have become increasingly popular with Industry 4.0 and Internet of Things (IoT) developers because advanced integration helps lower development costs, eases burden on RF design,  reduces time to market and simplifies procurement and certification. Today, Texas Instruments (TI) (NASDAQ: TXN) announces an expansion of its industry-leading wireless connectivity module portfolio with the availability of new SimpleLink™ Bluetooth® low energy certified modules with integrated antenna which provide the longest range with ultra-low power consumption. In addition to the new Bluetooth low energy modules, TI offers modules to ease development of products with Wi-Fi®, dual-mode Bluetooth, Wi-Fi + Bluetooth combo connectivity technology and more. Learn more at www.ti.com/wirelessmodules.

Connect more with TI's portfolio of wireless connectivity modules

Designing with TI's wireless connectivity modules provides an array of benefits to developers including:

  • Industry-leading RF performance with lowest-power, longest-range and proven interoperability with extensive quality and reliability testing.
  • Quicker development time thanks to pre-certified modules for FCC/IC/CE/TELEC country specific regulations and Wi-Fi Alliance certification, along with integrated antennas and TI tools ecosystem. TI also offers certified software stacks for the Bluetooth specification. Additionally, with the new SimpleLink Bluetooth low energy modules, developers have the flexibility to use the module as a single-chip solution or as a wireless network processor to easily add Bluetooth low energy to a range of IoT applications. 
  • Proven and dependable supply with millions of modules already shipped worldwide, offering easy migration path from module to IC solution for future additional cost reduction. TI also offers worldwide support through TI E2E™ community and sales channels.

In addition to the TI module portfolio, designers can take advantage of many third-party wireless module suppliers using TI wireless chips that offer additional options of form factor, antenna, software and design services.

Development kits and evaluation
TI's wireless connectivity module-based development kits are available now on the TI Store and through TI authorized distributors:

Learn more about TI's wireless connectivity modules:

  • Visit our wireless connectivity website on TI.com.
  • Watch our training videos to learn more about wireless connectivity.
  • Stay connected by subscribing to the ConnecTIng Wirelessly blog.

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world's brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at  www.ti.com.

Trademarks
SimpleLink, WiLink and E2E community are trademarks of Texas Instruments. All other trademarks belong to their respective owners.

Photo - http://photos.prnewswire.com/prnh/20161023/431555

 

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/connect-more-with-tis-portfolio-of-wireless-connectivity-modules-for-industry-40-and-iot-designs-300349554.html

SOURCE Texas Instruments

Contact:
Texas Instruments
Allie Hopkins, Golin, 469-680-2551
Email Contact Amy Szeto, Texas Instruments, 214-567-7513, a- Email Contact
Web: http://www.ti.com




Review Article Be the first to review this article
SolidCAM - See For Yourself

Featured Video
Editorial
Jobs
Mechanical Engineer for Flextronics at Milpitas, California
Failure Analysis Engineer for Flextronics at Milpitas, California
Geodesign Manager for Design Workshop at Aspen, Colorado
Upcoming Events
DEVELOP 3D Live 2020 New Date November 3rd at Sheffield University ctagon and INOX Building, Durham Road Sheffield United Kingdom - Nov 3, 2020
Digital Twin 2020 - Now in November 2020 at Melbourne FL - Nov 4 - 5, 2020
Sensors Expo & Conference at McEnery Convention Center SAN JOSE CA - Nov 16 - 18, 2020
3D Collaboration & Interoperability Congress at Golden CO - Feb 20 - 24, 2021
Kenesto: 30 day trial



© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise