M31 Technology Deploys the Full Range of IP for TSMC 22nm ULP/ULL Process

Highlights:

M31’s IP solutions for TSMC 22nm ULP/ULL process include Standard Cell Library, Memory Compilers, and General Purpose IO Library (GPIO), as well as PHYs for MIPI, USB, and PCIe.

• M31’s IP for the 22nm ULP/ULL process enables designers to develop SoCs for IoT, GPS, RF, 5G and many other applications.

• Long-standing relationship between the two companies has resulted in the successful development of M31 IP from 180nm to 12nm.

Hsinchu, Taiwan - April 25, 2018 M31 Technology Corporation (Taiwan stock code: 6643), a global Silicon Intellectual Property (IP) boutique, today announced its collaboration with TSMC to deploy the full range of IP for TSMC 22nm ULP/ULL technology. These IP include Standard Cell Library, Memory Compilers, and General Purpose IO Library (GPIO), as well as PHYs for MIPI, USB, and PCIe. M31’s IP solutions on the 22nm ULP/ULL process help IC customers to realize the features and benefits of a low power, high performance, and cost effective SoC design.

TSMC's 22nm ULP/ULL process technology is an optimized version of 28nm process technology which offers advantages of low power consumption/low leakage and high performance while remaining highly cost-effective. Compared with 28HPC+ process technology, TSMC's 22nm ULP/ULL process technology can help reduce chip area by about 5% to 10%, cut power consumption by about 25% at the same operating speed, or increase performance by about 15% under the same power consumption. Customers’ product applications developed on this process technology will cover IoT, GPS, RF, 5G and many other applications.

Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division, said: "TSMC has a complete IP ecosystem with four application-specific platforms: Mobile, High-Performance Computing, Automotive, and IoT platforms. TSMC’s 22nm ULP/ULL process technology, and supported IP from M31 Technology, will enable customers to realize heightened benefits of performance and power while designing products on these powerful platforms."

H.P. Lin, CEO of M31 Technology, stated that “M31’s IP developed on TSMC 22nm ULP/ULL process, is particularly applicable for IoT and various intelligent IC markets. It will help SoC designers to achieve the goals of lower power consumption, higher performance, and cost effective design. M31 will continue its IP development and validation in TSMC advanced process technologies to provide distinctive and innovative silicon IP to our customers.”

M31 Technology has been a member of TSMC’s IP Alliance Program since 2012 and has developed various IP for TSMC processes, ranging from 180nm to 12nm. In the future, M31 will continue to develop high-quality “boutique IPs” based on the spirit of ultimate technology to the global IC industry. 

ABOUT M31 TECHNOLOGY

M31 Technology Corporation is a leading silicon intellectual property (IP) provider. The company was founded in July, 2011 with its headquarters in Hsinchu, Taiwan. M31’s strength is in its R&D and customer services. With substantial successful experiences in IP development, IC design and electronic design automation fields, M31 focuses on high-speed interface IP, memory compilers, standard cell library and ESD/IO library solutions. For more information please visit  http://www.m31tech.com 



Contact:

Shirley Hsu
+886 3 5601866 ext. 123
Email Contact 




Review Article Be the first to review this article
Featured Video
Editorial
Latest Blog Posts
Industry ExpertsMCADCafe Editorial
by Industry Experts
MCADCafe Industry Predictions for 2022 – Xometry
Jobs
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Engineering / Software Sales Representative for Azore CFD Software at Livonia, Michigan
GIS Data Analyst for Texas Department of Transportation at Austin, Texas
GIS Analyst for New Mexico Gas Company, Inc. at Albuquerque -New Mexico, Wyoming
Fluid Dynamic Engineer / CFD Developer for Azore CFD Software at Livonia, Michigan
Upcoming Events
RAPID + TCT 2021 at Detroit MI - May 17 - 19, 2022
Simulation World 2022 at United States - May 18, 2022
3DEXPERIENCE FORUM 2022 at Diplomat Beach Resort Hollywood FL - Jun 6 - 8, 2022
Smart Manufacturing Experience at Pittsburgh PA - Jun 7 - 9, 2022



© 2022 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise