DINI Group announces immediate availability of the DNVUPF4A – Prototyping for 5G

November 19, 2018 -- DINI Group announces immediate availability of the DNVUPF4A, an ASIC prototyping system hosting 4 of the Xilinx Virtex UltraScale+ VU13P, the industry’s largest FPGA for DSP applications. A DNVUPF4A has a capacity of 80 million ASIC gates along with 48,912 DSP blocks. Seamless stacking of 8 or more boards is native to the architecture, enabling high speed prototyping of ASICs and SOCs needing 1 billion or more gates. Combined with high speed ADCs and DACs via FMC, the DNVUPF4A is ideal for 5G prototyping. The DNVUPF4A joins a long list of high capacity, high performance FPGA products from the industry’s established leader in large FPGA platforms.

The DNVUPF4A hosts four of the high I/O-count VU13P in the 2104-pin BGA package. This 16nm, 2.5D FPGA contains the largest number of DSP slices in a single FPGA. Each VU13P contains 3.456 million flip-flops, helping to ease the always difficult task of logic partitioning. The fixed, high performance interconnect between the four FPGAs on a board can be augmented with off-the-shelf cables, allowing customization of the FPGA to FPGA interconnect. The Virtex UltraScale+ FPGA contains high-speed transceivers capable of 25GbE without need for an external PHY. These transceivers enable prototyping of GEN4 PCIe, SATA III, 10/40/100 GbE, and USB3.0. An onboard processor boots to LINUX and has remote hosting capability, so teams from all over the globe can access the hardware without being physically present.

DDR4 memory, and other peripherals such as ADC/DAC and flash can be added from DINI Group’s large list of off-the-shelf add-on cards. The DNVUPF4A is shipping today with short lead times.

“We made this new DNVUPF4A Virtex UltraScale+ board for 5G prototyping. We used the biggest possible package.” says Mike Dini, president. “It is perfectly suited for the development and testing of 5G algorithms. This product frees our customers from spending precious resources designing and debugging their own FPGA-based hardware.”

DINI Group is an established leader in large, FPGA-based boards, critical IP, and systems. DINI Group FPGA boards are used in large quantities for ASIC and SOC prototyping, low-latency trading, and high-performance computing. From their corporate campus in La Jolla, California, DINI Group employees have supplied over fifteen billion ASIC gates.



Contact:

Mike Dini
President
858-454-3419 x11
Email Contact
www.dinigroup.com




Review Article Be the first to review this article

SolidCAM - See For Yourself

Featured Video
Editorial
Latest Blog Posts
Sanjay GangalMCADCafe Lens
by Sanjay Gangal
NVIDIA GTC October 2020 Keynote
Jobs
Mechanical Engineer for Flextronics at Milpitas, California
3D Designer and Developer for Los Alamos National Laboratory at Los Alamos,, New Mexico
Failure Analysis Engineer for Flextronics at Milpitas, California
Structural Engineer 2 (Engineer 2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Architect for Hutton at Wichita, Afghanistan
Design Engineer (Engineer 1/2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Upcoming Events
DEVELOP 3D Live 2020 New Date November 3rd at Sheffield University ctagon and INOX Building, Durham Road Sheffield United Kingdom - Nov 3, 2020
Digital Twin 2020 - Now in November 2020 at Melbourne FL - Nov 4 - 5, 2020
Sensors Expo & Conference at McEnery Convention Center SAN JOSE CA - Nov 16 - 18, 2020
Spatial 3D Insider Summit - Free VR Event! at United States - Nov 16 - 17, 2020
Kenesto: 30 day trial



© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise