Toshiba Memory America Unveils 1TB Single Package PCIe Gen3 x4L SSDs with 96-Layer 3D Flash Memory

New BG4 Series Doubles Capacity and Delivers Industry-Leading Random Read Speeds1

LAS VEGAS — (BUSINESS WIRE) — January 8, 2019 — Today at CES® 2019, Toshiba Memory America, Inc., the U.S.-based subsidiary of Toshiba Memory Corporation, will introduce the fourth generation of its single package ball grid array (BGA) solid state drive (SSD) product line: the BG4 series. Toshiba Memory’s new lineup of ultra-compact NVMe™ SSDs places both the flash and an all-new controller into one package, bringing design flexibility to ultra-thin PC notebooks, embedded systems and server boot in data centers.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190108005289/en/

Toshiba Memory America's BG4 series – a new lineup of ultra-compact, single-package NVMe SSDs – brin ...

Toshiba Memory America's BG4 series – a new lineup of ultra-compact, single-package NVMe SSDs – brings flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers. The BG4 series leverages the company's innovative 96-layer BiCS FLASH. (Photo: Business Wire)

“The BGA form factor SSD enables larger amounts of flash to be added to smaller and thinner devices and extends battery life to improve the mobile experience,” said Jeff Janukowicz, research vice president, Solid State Drives and Enabling Technologies at IDC. “NVMe BGA solutions, such as the new Toshiba BG4 series, provide OEMs with a better-than-SATA storage option that boosts demand for client SSD units. In fact, we expect this demand to increase at a 2017-2022 CAGR of 14 percent.”

Toshiba Memory Corporation has long been at the forefront of delivering SSDs that enable smaller, thinner, lighter, and more power efficient mobile designs. The company was the first to develop a single package PCIe® SSD, and the introduction of the fourth generation BG series represents another pioneering achievement as the densest client SSD by volumetric measurements2. Utilizing Toshiba Memory’s innovative 96-layer BiCS FLASHTM 3D memory, BG4 increases the maximum capacity from 512 gigabytes to 1024GB (approximately 1TB)3 and provides a slim 1.3mm profile for capacities up to 512GB4. Furthermore, the BG4 series doubles the PCIe Gen3 lane count from 2 to 4, delivering more performance in the same power envelope when compared to the prior generation product.

Performance improvements5 over the BG3 series include:

  • Up to 2,250 megabytes per second sequential read (50 percent improvement) and up to 1,700MB/s sequential write performance6 (70 percent improvement)
  • Up to 380,000 random read IOPS (153 percent improvement) and 190,000 random write IOPS7 (90 percent improvement)

“When it comes to performance, the BG4 series bests client SATA drives by a factor of up to 4x8,” said Alvaro Toledo, vice president, SSD marketing and product planning for Toshiba Memory America, Inc. “Better performance, along with its optimized power consumption and compact footprint, is why the BG4 SSDs are rapidly replacing SATA SSDs in notebook and desktop PCs.”

BG4 SSDs feature a power-saving solution that improves power efficiency up to 20 percent in read and 7 percent in write9 and provides a low-power state 10 as low as 5mW (when compared to the BG3 series). The BG4 also improves its Host Memory Buffer (HMB) technology by increasing the accelerated read access range and optimizing background flash management. Additionally, BG4 includes new enhanced reliability features to protect against host DRAM failures when using the HMB feature.

“By continuously pushing the envelope of what is possible with flash and SSD technology, we are arming OEMs with the technology they need to gain a competitive advantage,” said Neville Ichhaporia, senior director of client and data center SSD marketing for Toshiba Memory America, Inc. “With BG4, we’re elevating the end-user experience with upgraded storage capacity and significantly improved performance, while continuing to make power efficiency a priority.”

Providing essential options for today’s mobile devices, Toshiba Memory’s new single package SSD is available in capacities of 128GB, 256GB, 512GB, and 1024GB (1TB), in either surface-mount BGA M.2 1620 (16 x 20mm) or removable M.2 2230 (22 x 30mm) modules. Pyrite drive (version 1.00) or self-encrypting drive (TCG Opal version 2.01) models11 are also available.

Toshiba Memory Corporation offers the industry’s broadest SSD portfolio, including a wide array of client SSDs. The BG4 series is currently sampling to select OEM customers, with general sample availability expected later in the second calendar quarter of 2019. Toshiba Memory America, Inc. will showcase the BG4 series in its private demo suite at the Venetian® Resort from January 8 – 11.

For more information, please visit www.toshiba.com/tma.

Notes:
PCIe is a registered trademark of PCI-SIG.
NVMe is a trademark of NVM Express, Inc.
All company names, product names and service names may be trademarks of their respective companies.

1 | 2 | 3  Next Page »



Review Article Be the first to review this article
Featured Video
Editorial
Latest Blog Posts
Joseph LopezPROSTEP INC Blog
by Joseph Lopez
OpenPDM MIGRATE supports Windchill Bulk Migrator
Roberto FrazzoliMCADCafe Editorial
by Roberto Frazzoli
A closer look at CCE’s EnSuite – Cloud ReVue LiveLink
Jobs
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
ASIC Architects and Hardware Engineers at D. E. Shaw Research for D. E. Shaw Research at New York, New York
Assistant Professor in Applied GIS for University of San Diego at San Diego, California
GIS Specialist for Schneider Geospatial at Indianapolis, Indiana
Senior Highway Engineer for RS&H at Jacksonville, Florida
Upcoming Events
Canadian Manufacturing Technology Show 2021 at The International Centre (Hall 2) 6900 Airport Road Mississauga, Ontario L4V 1E8 Canada - Oct 4 - 7, 2021
Houstex 2021 at George R. Brown Convention Center Houston TX - Oct 5 - 7, 2021
Autodesk University 2021 | Free digital conference at United States - Oct 5 - 14, 2021
HxGN Live Design & Engineering 2021 - Virtual at United Kingdom - Oct 12 - 14, 2021



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise