Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407

See Saki’s M2M communication in action at the Fuji booth 1317 and Hermes/CFX production line

FREMONT, Calif. — (BUSINESS WIRE) — January 22, 2019Saki Corporation, an innovator in the field of automated optical and x-ray inspection and measurement equipment, will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki’s M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.

Saki’s 3Di Series is the fastest AOI system in the industry. It has scalable resolutions of 7µm, 12µm, and 18µm, closed-loop functionality, and a sturdy frame with a dual-drive system, resulting in accuracy, stability, and reliability.

Demonstrations of Saki’s new version of Saki Self-Programming Software (SSP), the inspection industry’s first self-programming software, will be given. With Saki Self-Programming Software, no programming is necessary, no golden board is needed, and programming errors are eliminated.

New at IPC APEX is Saki’s 2D Bottom-side AOI System. Saki’s proprietary 2D high-speed imaging technology scans an entire 460 x 510mm printed circuit board assembly in one pass, capturing its image on-the-fly, in real time, storing the image into memory, and creating inspection data for the entire board. Saki’s bottom-side AOI system ensures PCB quality after dip, selective, and wave soldering. The system completely automates bottom-side inspection, including pin through-hole fillets. It’s fast, cost-effective, and eliminates the need for flipping the PCB.

Saki’s new 3D SPI and AOI systems have 12 megapixel cameras for the fastest inspection and highest resolution with high accuracy and repeatability. They offer closed-loop functionality and 2D and 3D inspection using an LCoS imaging system. Both systems are hardware compatible and come with Saki Self-Programming Software.

Previews will also be given of Saki’s new 3D AXI system. The system benefits from the technology advancements of Planar Computer Tomography that perfectly separates top and bottom sides of the PCB and takes continuous 3D images without joints. With a programmable resolution from 13–30µm and best-in-class Cpk and gage repeatability and reproducibility, it delivers 100% head-in-pillow detection. Saki’s AXI has been employed in the semiconductor industry for inspection and measurement of insulated gate bipolar transistors (IGBTs) and land grid arrays (LGAs).

“The past year has seen lots of changes, growth, and new equipment and technologies at Saki,” said Satoshi Otake, general manager of Saki America. “We are excited to share our news and developments with the electronics community. Please make an appointment on our website ( www.sakiglobal.com) or stop by our booth to find out more.”

For more information or to make an appointment contact Saki at 1.510.556.6459, email sales.us@sakiglobal.com, or visit our website at https://www.sakiglobal.com.

Photo at: https://saki-aoi.tech/ipcapex2019

About Saki Corporation

Since its inception in 1994, Saki has led the way in the development of automated recognition through robotic vision technology. Saki’s 3D automated solder paste, optical, and x-ray inspection systems (SPI, AOI, AXI) have been recognized to provide the stable platform and advanced data capture mechanisms necessary for true M2M communication, improving production, process efficiency, and product quality. Saki Corporation has headquarters in Tokyo, Japan, with offices, sales, and support centers around the world.



Contact:

Satoshi Otake - General Manager
SAKI America, Inc.
Phone: +1.510.556.6459
E-mail: Email Contact

Andrea Roberts
AR Marketing, Inc. (agency)
+1.858.204.9584
E-Mail: Email Contact




Review Article Be the first to review this article

SolidCAM - Speed up your complex CNCs

Featured Video
Editorial
Latest Blog Posts
Sanjay GangalMCADCafe Lens
by Sanjay Gangal
NVIDIA GTC October 2020 Keynote
Jobs
Product Design Engineer - Softgoods for Apple Inc at Cupertino, California
Service Software Expert-CATIA & CAA for Dassault Systemes at Shanghai, China
Industrial Engineer for Yanfeng Automotive Interiors -YFAI at Louisville-Jefferson, Kentucky
Director, Industrial Machinery Solutions- SISW PLM for Siemens AG at Livonia, Michigan
Senior Software Developer (Revit API) for Microdesk at Boston, Massachusetts
GIS Manager for Union County NC at Monroe, California
Upcoming Events
PLM Road Map & PDT Spring 2021 at 3909 Research Park Drive Ann Arbor MI - May 19 - 20, 2021
RAPID + TCT at McCormick Place Chicago IL - Sep 13 - 15, 2021
WESTEC Online at Online CA - Sep 21 - 23, 2021
3D Collaboration & Interoperability Congress at Golden CO - Feb 21 - 24, 2022
Kenesto: 30 day trial



© 2021 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise