RadiSys Announces Portfolio of Extended Temperature, Ruggedized Procelerant™ COM Express™ Modules Based on Intel® Processors

NUREMBERG, Germany—(BUSINESS WIRE)—March 3, 2009— Today at Embedded World, RadiSys® Corporation (NASDAQ:RSYS), a leading global provider of advanced embedded solutions, announced the new Procelerant™ CEZ5XL, an industrial-temperature (-40C to +85C), ruggedized COM Express* module based on the recently announced options for the Intel® Atom™ processor Z5xx series. The CEZ5XL is the latest in the RadiSys Procelerant™ family of COM Express products and was designed for use in industrial automation, transportation, military, aerospace and government products that need to withstand harsh environmental conditions. Additionally, RadiSys Procelerant™ CEGSXT (based on the Intel® Core™2 Duo processor) and CEZ5XT (based on the Intel® Atom™ processor) modules have been upgraded and can now support operation in extended temperature range (-25C to +70C).

These modules are also a perfect match for the new RadiSys Procelerant™ Integrated Systems (IS) (see accompanying announcement). The Procelerant™ IS 1000 is a suite of embedded system platforms built on COM Express modules, or Single Board Computers, combined with fully integrated operating systems and software solutions for target applications. Incorporating these extended temperature modules the Procelerant IS can address business applications more effectively in areas like industrial automation.

The extended temperature range of the Procelerant CEZ5XL opens up new opportunities for companies developing military and government equipment for example. Incorporating the CEZ5XL into their designs means the same unmanned ground vehicles can be used in extreme environments like those found in Baghdad or the North Pole.

“Offering a full suite of extended temperature, rugged COM Express modules means our customers can select the ideal module for their design based on performance, power and temperature requirements,” said Wade Clowes, Vice President and General Manager of commercial markets for RadiSys. ”Incorporating the latest Intel® technology, which comes with a seven-year long lifecycle, enables us to meet customers’ current and future design specifications.”

“Intel has extended the low-power Intel Atom processor Z5xx series platform to offer an industrial temperature range specifically for embedded applications,” said Jonathan Luse, Director of Marketing, Low Power Embedded Products Division, Intel. “This allows rugged modules, such as the new RadiSys Procelerant CEZ5XL, to be used in many embedded applications that are deployed in unconstrained thermal environments, such as industrial settings and transportation systems.”

RadiSys Extended Temperature COM Express Modules

The RadiSys Procelerant CEZ5XL is one of the industry’s first Intel® architecture-based COM Express modules that can operate in industrial temperature range of -40C to +85C. The module also features enhanced I/O made possible via a PCI bridge and PCIe switch that provides 4x PCIe interfaces to the COM Express B2B connector. Additionally, the module includes a SATA controller and optional on-board PATA SSD. While the CEZ5XL offers a balance of I/O, the Procelerant CEZ5XT offers the lowest power while the Procelerant CEGSXT delivers the highest performance. Both the CEZ5XT and CEGSXT have been tested for ruggedized environments with more robust shock and vibration specifications.

Product Availability

The Procelerant CEZ5XL, CEZ5XT and CEGSXT samples are available today. For ordering information, please call 800-950-0044 or 503-615-1100.

About Procelerant COM Express

RadiSys Procelerant COM Express products help equipment manufacturers shorten their time-to-market and reduce development costs. By removing the processor, chipset, and memory from the rest of the design, manufacturers can focus engineering resources on developing differentiating features and avoid the design churn that comes with implementing new processor generations. RadiSys also provides a wide range of COM Expert custom services that further accelerate customer time-to-market by supplying carrier concept definition and design, carrier schematic reviews, BIOS customization, and thermal design.

About RadiSys

RadiSys (NASDAQ:RSYS) is a leading provider of advanced solutions for the communications networking and commercial systems markets. Through intimate customer collaboration and combining innovative technologies and industry leading architecture, RadiSys helps OEMs, systems integrators and solution providers bring better products to market faster and more economically. RadiSys products include embedded boards, application enabling platforms and turn-key systems, which are used in today's complex computing, processing and network intensive applications.

For more information, visit http://www.radisys.com, write to Email Contact, or call 800-950-0044 or 503-615-1100. Editors seeking more information may contact Lyn Pangares at RadiSys Corporation at 503-615-1220 or Email Contact

Intel, Intel Core and Intel Atom are trademarks of Intel Corporation in the U.S. and other countries.

RadiSys and Procelerant are registered trademarks of RadiSys Corporation.

*All other trademarks are property of their respective owners.

Photos/Multimedia Gallery Available: http://www.businesswire.com/cgi-bin/mmg.cgi?eid=5908022&lang=en.


RadiSys Corporation
Lyn Pangares, 503-615-1220
Email Contact

Review Article Be the first to review this article

SolidCAM - See For Yourself

Featured Video
Latest Blog Posts
Sanjay GangalMCADCafe Lens
by Sanjay Gangal
NVIDIA GTC October 2020 Keynote
Failure Analysis Engineer for Flextronics at Milpitas, California
Mechanical Engineer for Flextronics at Milpitas, California
3D Designer and Developer for Los Alamos National Laboratory at Los Alamos,, New Mexico
Architect for Hutton at Wichita, Afghanistan
Structural Engineer 2 (Engineer 2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Design Engineer (Engineer 1/2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Upcoming Events
DEVELOP 3D Live 2020 New Date November 3rd at Sheffield University ctagon and INOX Building, Durham Road Sheffield United Kingdom - Nov 3, 2020
Digital Twin 2020 - Now in November 2020 at Melbourne FL - Nov 4 - 5, 2020
Sensors Expo & Conference at McEnery Convention Center SAN JOSE CA - Nov 16 - 18, 2020
Spatial 3D Insider Summit - Free VR Event! at United States - Nov 16 - 17, 2020
Kenesto: 30 day trial

© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise