ARM Announces 45nm SOI Test Chip Results That Demonstrate Potential 40 Percent Power Savings Over Bulk Process

SOI Test Chip Results Detailed at IEEE Conference

CAMBRIDGE, England — (BUSINESS WIRE) — October 8, 2009 — ARM [(LSE: ARM); (Nasdaq: ARMH)] announced at the IEEE SOI Conference, Foster City, Calif., the results from a silicon-on-insulator (SOI) 45nm test chip that demonstrate potential power savings of up to 40 percent over traditional bulk process for manufacturing chips. The test chip was based on an ARM 1176™ processor and enables a direct comparison between SOI and bulk microprocessor implementations. The results confirm SOI technology is a viable alternative to traditional bulk process technology when designing low-power processors for high-performance consumer devices and mobile applications.

ARM® and Soitec collaborated to produce a test chip to demonstrate the power savings in a real silicon implementation with a well-known, industry-standard core. The goal was to produce a comparison of 45nm SOI high-performance technology with bulk CMOS 45nm low-power (LP) technology of the same product.

“As a technology leader in physical IP and processors, ARM has been an active proponent of the benefits SOI may bring to our customers’ products,” said Tom Lantzsch, vice president, physical IP division, ARM. “Investing the resources to conduct a bulk vs. SOI comparison provides useful data to address previously speculated claims and demonstrates that there can be performance and power savings benefits from SOI.”

The silicon results show that 45nm high-performance SOI technology can provide up to 40 percent power savings and a 7 percent circuit area reduction compared to bulk CMOS low-power technology, operating at the same speed. This same implementation also demonstrated 20 percent higher operating frequency capability over bulk while saving 30 percent in total power in specific test applications.

“This benchmark by ARM and Soitec clearly demonstrates the potential power/performance benefits of our sixth-generation 45nm SOI technology now available to both ASIC and foundry clients,” said Mark Ireland, vice president, Semiconductor Products & Services, IBM. “Validating the power advantage of SOI with an industry-standard ARM processor demonstrates the possibilities for SOI adoption in the digital consumer electronic segment.”

“This is a significant step for the industry, as the collaborative efforts of SOI Consortium member companies have produced a proof-point that the energy efficiency of SOI technology could cover battery operated applications,” said Horacio Mendez, executive director of the SOI Industry Consortium. “Many companies will benefit from this data in considering their technology manufacturing decision.”

The design was implemented using ARM and IBM standard SOI libraries and leading EDA tools. The IP ecosystem and manufacturing solutions are in place for design starts with ARM and IBM libraries on IBM 45nm SOI technology.

About ARM

ARM designs the technology that lies at the heart of advanced digital products, from wireless, networking and consumer entertainment solutions to imaging, automotive, security and storage devices. ARM’s comprehensive product offering includes 32-bit RISC microprocessors, graphics processors, video engines, enabling software, cell libraries, embedded memories, high-speed connectivity products, peripherals and development tools. Combined with comprehensive design services, training, support and maintenance, and the company’s broad Partner community, they provide a total system solution that offers a fast, reliable path to market for leading electronics companies. More information on ARM is available at http://www.arm.com.

ARM is a registered trademark of ARM Limited. Cortex is a trademark of ARM Limited. All other brands or product names are the property of their respective holders. “ARM” is used to represent ARM Holdings plc; its operating company ARM Limited; and the regional subsidiaries ARM Inc.; ARM KK; ARM Korea Limited.; ARM Taiwan Limited; ARM France SAS; ARM Consulting (Shanghai) Co. Ltd.; ARM Belgium N.V.; ARM Germany GmbH; ARM Embedded Technologies Pvt. Ltd.; ARM Norway, AS; and ARM Sweden AB.



Contact:

ARM
Erik Ploof, +1 425-880-6033
Email Contact
or
Racepoint Group
RJ Bardsley, +1 415-694-6740
Email Contact


Reviews:
Review Article
For more discussions, follow this link …

SolidCAM - See For Yourself

Featured Video
Editorial
Latest Blog Posts
Sanjay GangalMCADCafe Lens
by Sanjay Gangal
NVIDIA GTC October 2020 Keynote
Jobs
Failure Analysis Engineer for Flextronics at Milpitas, California
Mechanical Engineer for Flextronics at Milpitas, California
3D Designer and Developer for Los Alamos National Laboratory at Los Alamos,, New Mexico
Architect for Hutton at Wichita, Afghanistan
Design Engineer (Engineer 1/2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Structural Engineer 2 (Engineer 2) for Los Alamos National Laboratory at Los Alamos,, New Mexico
Upcoming Events
DEVELOP 3D Live 2020 New Date November 3rd at Sheffield University ctagon and INOX Building, Durham Road Sheffield United Kingdom - Nov 3, 2020
Digital Twin 2020 - Now in November 2020 at Melbourne FL - Nov 4 - 5, 2020
Sensors Expo & Conference at McEnery Convention Center SAN JOSE CA - Nov 16 - 18, 2020
Spatial 3D Insider Summit - Free VR Event! at United States - Nov 16 - 17, 2020
Kenesto: 30 day trial



© 2020 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise