Samsung’s New High-Performance Wireless USB SOC Solution Brings Short-Range Wireless Communications to CE Products

LSI Introduces Ultramapper II SoC for Higher-Quality, Lower-Cost Multi-service Network Applications

I&C Technology Selects Mixed-Signal IP from S3 for Mobile TV SoC

MosChip Launches Pair of System-on-a-Chip (SoC) Network Appliance Processors Touting Market-First Support for PCI Express, Gigabit Ethernet and Display Interfaces

Maxim Integrated Products Acquires Innova Card, Leading System-On-Chip (SoC) Manufacturer For Secure Terminals

ORSoC and AsiusTech form strategic partnership

Duncan McCallum, CEO Digital Alloys

NVIDIA GTC October 2020 Keynote Part 8: Breakthroughs in Autonomous Machine Development NVIDIA

Iana Aranda, Director, Engineering Global Development Programs ASME

MCADCafe Editorial by 2021 MCADCafe Predictions Planning for XR in 2021-It’s all about the use case

MCADCafe Lens by Sanjay Gangal NVIDIA GTC October 2020 Keynote

Service Software Expert-CATIA & CAA for Dassault Systemes at Shanghai, China

EUROMED 3DEXPERIENCE Program Marketing Specialist for Dassault Systemes at Padova, Italy

Product Design Engineer - Softgoods for Apple Inc at Cupertino, California

Back-End Product Engineer - ArcGIS Urban for ESRI at Redlands, California

Systems Engineer for Watts Water Technologies at Blauvelt, New York

Sr. Application Engineer for Watts Water Technologies at San Antonio, Texas

3DEXPERIENCE WORLD 2021 at Virtual Event - Feb 8 - 11, 2021

RAPID + TCT at McCormick Place Chicago IL - Apr 26 - 29, 2021

WESTEC Online at Online CA - Sep 21 - 23, 2021

3D Collaboration & Interoperability Congress at Golden CO - Feb 21 - 24, 2022