Moldex3D Selects Winners of Global Innovation Talent Award Contest
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Moldex3D Selects Winners of Global Innovation Talent Award Contest

July 28, 2015- Hsinchu, Taiwan- Plastics may be one of the most commonly used materials today, but using them to create high-quality, low-cost products on time has never been more complex and challenging. CoreTech System Co., Ltd. (Moldex3D) recently hosted  the 3rd Global Innovation Talent Award, an annual CAE application contest that recognizes the most innovative applications being developed to tackle real-world plastic manufacturing challenges.

This year’s contest drew a record number of participants from USA, Russia, Philippines, Italy, Korea, Vietnam, China, Taiwan and other countries, the largest turnout since the contest began in 2012. After two rounds of judging, the winners in the Company and Student Categories have been selected and announced today.

The First Prize in the Company category goes to  Lite-On Technology Corporation, the leading provider of imaging products. Lite-On Technology combined  Moldex3D simulation capabilities and  LS-DYNA structural analysis to improve the dimensional stability of the Contact Image Sensor (CIS) holder of a scanner and ensure it would be within tolerance after molding. “The Global Innovation Talent Award provides a great opportunity for Lite-On to showcase advanced CAE skills and applications,” said Alan Ting, Principle Engineer of Mechanical Competence at Lite-On Technology. “Enabling a more realistic verification of part designs, the software gives our team the chance to make quick and informed decisions on what we need to do to keep products free from defects.”

In the Student Category, students from the  Chung Yuan Christian University won the First Prize. Their winning entry, titled “ A Study of the Influences of Processing Parameters and Glass Fiber Material on Roundness Using Moldex3D,” leveraged Moldex3D solutions to gain in-depth understanding of how each processing parameter contributes to the roundness of the camera lens hood and found the optimum conditions to reduce warpage.

“Moldex3D is more than just a simulation tool,” said RY Chang, CEO of Moldex3D. “The launch of the contest for the 3rd year has demonstrated the unlimited potential for innovation with Moldex3D solutions. It gives our users the ability to think outside the box and gain insight into new possibilities that help them adapt to challenges that were previously impossible to overcome.”

For more information about the winning entries, please visit  2015 Global Innovation Talent Award Winner Showcase Page.

About CoreTech System (Moldex3D)
CoreTech System Co., Ltd. (Moldex3D) has been providing the professional CAE analysis solution “Moldex” series for the plastic injection molding industry since 1995, and the current product “Moldex3D” is marketed worldwide. Committed to providing advanced technologies and solutions to meet industrial demands, CoreTech System has extended its sales and service network to provide local, immediate, and professional service. CoreTech System presents innovative technology, which helps customers troubleshoot from product design to development, optimize design patterns, shorten time-to-market, and maximize product return on investment (ROI). More information can be found at

The full list of winners is as follows:

Company Category

First Prize: Lite-On Technology Corporation
Alan Ting, Jeffery Lin, Jack JH Wang, Peter PC Chang
Improving the Warpage in a Scanner CIS Holder Part using Moldex3D and LS-DYNA

Second Prize: TomTom
Enoch Chen
Using Moldex3D to Reduce Warpage in a Cradle of Truck GPS Navigation Devises

Third Prize: TYC Brother Industrial Co., Ltd.
Nan-Jung Huang, Jin-Zhih Cheng, Chun-Nan Chiu, Chih-Yuan Fu, Fu-Chi Tsai
Solving Air Traps in BMC (Bulk Molding Compound) Automotive Headlight Reflectors

Special Prize: Acer Inc.
Johnson JS Chen, Tsu-Ying Chen, Lin-Fei Fan
Using Design of Experiment (DOE) Analysis to Solve Ink Washout and Residual Stress Issues in Thin-wall Injection Molded Ultrabook Base Cases

Special Prize: Synventive Molding Solutions
Sal LoGrasso
Using Moldex3D to Simulate Synventive’s activeGate™ Technologies

Special Prize: Metal Industries Research Development Centre
Yan-Chao Wang
Analyzing the Optical Properties of a Double-sided Micro Lens Array in Laser Projectors

Special Prize: KOPLA
Y.G Lee
Solving Warpage Problem through Injection Analysis and Structural Analysis

Special Prize: Calin Technology Co., Ltd.
Yi-Rui Huang
Moldex3D Injection Molding Simulation Applications in Projector Lens

Special Prize: Linear Mold & Engineering
David Moore
Improvement of Injection Molding Cycle Process

Student Category

First Prize: Chung Yuan Christian University
Ying-Fan Lou, Kuan-Hua Lee, Chia-Chun Chen
A Study of the Influences of Processing Parameters and Glass Fiber Material on Part Roundness using Moldex3D

Second Prize: National Kaohsiung University of Applied Sciences
Hong-Yao Pan
The Study of Volumetric Shrinkage using Zirconia Ceramic for Artificial Dental Roots with Two-shot Sequential Molding Application

Third Prize: The Ohio State University
Likai Li
Microinjection Molded Miniature Freeform Alvarez Lenses

Special Prize: National Kaohsiung University of Applied Sciences
An Lyu
Applying MCM Process in Thick Lens Design

Special Prize: National Kaohsiung University of Applied Sciences
Wei-Sian Wang
The Cause of Sink Marks and the Dynamic Measurement of Thick Lens for Automotive

Special Prize: National Taiwan University of Science and Technology
Chang-Shun Lai, Samuel
The Study of the Effect of Glass Fibers on Poly Lactic Acid (PLA) and Structural Integrity

Special Prize: National Chiayi University
Yu-Chen Hsu, Bei-Hua Yang , Yu-Wen Chen
Applying Static Mixers in a Multi-cavity Design to Reduce Runner’s Corner Effect

Special Prize: National Yunlin University of Science and Technology
Kuan Dian Chen
The Study of Product Warpage in Co-injection Molding

Special Prize: Beijing University of Chemical Technology
Hai-Chao Liu, Miao-Miao Liu
Improvement on the 2.5 Inch NPSM Screw Thread Requirement of a Plastic Bottle Cap


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